Brand Nedis
Heat sink compound suitable for PCBs in transistors, for diodes, CPUs etc.
Details
• Use it between -50 and 180 °C
• 25 g compound injection type
Package Contents
Product Dimensions
| Length | 30 |
| Width | 30 |
| Height | 210 |
| Weight | 0.04 Kg |
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Description
Product Information
Part Number HSPA25I
Products in Package 1 pcs
Material Plastic
Brand Nedis
Heat sink compound suitable for PCBs in transistors, for diodes, CPUs etc.
Details
• Use it between -50 and 180 °C
• 25 g compound injection type
Package Contents
Product Dimensions
| Length | 30 |
| Width | 30 |
| Height | 210 |
| Weight | 0.04 Kg |
Part Number HSPA25I
Products in Package 1 pcs
Material Plastic
Nedis Heat Sink Paste | Syringe | 1 pcs
Regular price
£5.38
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